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Protavic America
  • Passive Component Materials
  • Electronic Assembly Materials
  • Smart Cards & RFID Materials
  • Acoustic Assembly Materials
  • Silver Nanowires
  • Telecommunication Materials
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  • Phone: 603.623.8626

  • info@protavicamerica.com
  • 8 Ricker Avenue

    Londonderry NH, 03053

    USA

Protavic America (Current Site)
Protavic Korea
Protavic China
Protavic France

Our Product Applications

Electronic Assembly Materials

The number of markets for electronics is limitless.

To support the manufacturing of electronic components that serve a variety of specifications and uses, PROTAVIC has developed a range of resins and chemical adhesives meeting the needs of electronic component assembly: power modules, sensors, integrated circuits and MEMs.

ASSEMBLY TECHNOLOGIES

 

 

Dam & Fill and Glob-Top

To coat and protect components.

The Dam provides a protective barrier around the component, while the Fill fills in the area created by the Dam.

Glob-top provides theĀ same two functions for smaller components.

Die-Attach

Die-Attach is the bonding of semiconductors to substrates with an adhesive that is either electrically conductive or insulating.

Encapsulation and potting

Liquid insulating resins used to encapsulate printed circuits and electronic components, protecting them from environmental stressors.

Thermal dissipation

Thermally conductive adhesives and resins that dissipate component operational heat generation.

Underfill

Underfill is placed between a chip, or a BGA, and its support. The adhesive protects against possible shocks, drops and vibrations.

Protavic

Our sales team is ready to support you and your projects.

Contact
Protavic America (Current Site)
Protavic Korea
Protavic China
Protavic France
Contact
  • Phone: 603.623.8626

  • info@protavicamerica.com
  • 8 Ricker Avenue

    Londonderry NH, 03053

    USA

Protavic America

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