Thermal dissipation

Attaching heat-generating components to electronic assemblies requires thermally conductive adhesives to avoid creating hot spots.

In addition, the miniaturization and increased power density of electronic components has led to higher temperatures, further increasing the demand for thermally conductive, heat dissipating materials.

The PROTAVIC product line meets the need for heat dissipation through thermally conductive pottings designed for optimal heat transfer.

Some examples are listed in the table below.

Technical description

Name

Color

Chemistry

Density

Viscosity at 25°C (mPa.s)

Glass transition temperature (TG)

CTE (ppm/°C)

Shore hardness

Thermal conductivity (W/(m.K))

Dielectric strength (kV/mm)

Percent load

Open time

Polymerization / Crosslinking

Storage

Associated Fill product

Thixotropic index of the Fill

Solvent

Particle diameter

PROTAVIC® ATE 10120

White

Epoxy

1.6

10000

75°C

55

-

>1

>15

34

1 month

90 min at 75°C

1 year at -20°C

-

-

-

-

PROTAVIC® PTM 60331

Yellow

Polyimide

1.7

10000

-

-

-

-

-

-

16 hours

1h at 150°C + 1h at 275°C

6 months at 20°C

-

-

-

-

PROTAVIC® PTS 46303-3

Black

Silicone

-

12000

-48°C

250

A35

1

25

-

4 hours

20 min at 125°C

6 months at 25°C

-

-

-

-

PROTAVIC® PTS 80001

Grey

Silicone

3.2

70000

<0°C

<40

D85

>4

-

-

24 hours

48 hours at 40°C 95%RH

6 months at -20°C

-

-

-

-

PROTAVIC® ATE 10120

White

Epoxy

Chemistry

1.6

Density

10000

Viscosity at 25°C (mPa.s)

75°C

Glass transition temperature (TG)

55

CTE (ppm/°C)

-

Shore hardness

>1

Thermal conductivity (W/(m.K))

>15

Dielectric strength (kV/mm)

34

Percent load

1 month

Open time

90 min at 75°C

Polymerization / Crosslinking

1 year at -20°C

Storage

-

Associated Fill product

-

Thixotropic index of the Fill

-

Solvent

-

Particle diameter

PROTAVIC® PTM 60331

Yellow

Polyimide

Chemistry

1.7

Density

10000

Viscosity at 25°C (mPa.s)

-

Glass transition temperature (TG)

-

CTE (ppm/°C)

-

Shore hardness

-

Thermal conductivity (W/(m.K))

-

Dielectric strength (kV/mm)

-

Percent load

16 hours

Open time

1h at 150°C + 1h at 275°C

Polymerization / Crosslinking

6 months at 20°C

Storage

-

Associated Fill product

-

Thixotropic index of the Fill

-

Solvent

-

Particle diameter

PROTAVIC® PTS 46303-3

Black

Silicone

Chemistry

-

Density

12000

Viscosity at 25°C (mPa.s)

-48°C

Glass transition temperature (TG)

250

CTE (ppm/°C)

A35

Shore hardness

1

Thermal conductivity (W/(m.K))

25

Dielectric strength (kV/mm)

-

Percent load

4 hours

Open time

20 min at 125°C

Polymerization / Crosslinking

6 months at 25°C

Storage

-

Associated Fill product

-

Thixotropic index of the Fill

-

Solvent

-

Particle diameter

PROTAVIC® PTS 80001

Grey

Silicone

Chemistry

3.2

Density

70000

Viscosity at 25°C (mPa.s)

<0°C

Glass transition temperature (TG)

<40

CTE (ppm/°C)

D85

Shore hardness

>4

Thermal conductivity (W/(m.K))

-

Dielectric strength (kV/mm)

-

Percent load

24 hours

Open time

48 hours at 40°C 95%RH

Polymerization / Crosslinking

6 months at -20°C

Storage

-

Associated Fill product

-

Thixotropic index of the Fill

-

Solvent

-

Particle diameter

For more information see the brochure:

Leaflet printed card