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THERMALLY CONDUCTIVE PRODUCTS Our thermal product offering includes encapsulation, casting and one- and-two part adhesives. The products listed below are electrically insulating and are often used for power supply encapsulation , high power casting and heat sink bonding. Please review the partial listing below for some of our best sellers. If you cannot find one that meets your needs, give us a call or send us an email. Benefits · Aray of material types· UL-recognized products · One & Two component systems · Made with electronics-grade raw materials · Visit our MixPac™-compatible products listing Note: For higher thermal performance with electrical conductivity, please refer to our Electrically Conductive product offering products. |
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| Product | Description | Mixed Viscosity | Specific Gravity @ 25°C |
Thermal Conductivity Wm°K | Operating Temp.°C |
| PTS-46323 | Filled silicone system with excellent thermal properties (1.4Wm°K). Fast flow for void free applications. This material does not require primers and has good adhesion to most substrates. It is commonly used for the encapsualtion of power supplies and other high voltage devices. This material passes Belcore85/85 and UL 94v0. | 10,000 | 2.2 | 1.4 | -55 to +200 |
| PTS-46313 | Filled silicone system with excellent thermal properties (1.4Wm°K). Fast flow for void free applications. This material does not require primers and has good adhesion to most substrates. It is commonly used for the encapsualtion of power supplies and other high voltage devices. This material passes Belcore85/85 and UL 94v0. This product is a one part system which requires cold storage prior to use. It is an excellent product for small use or environments without mixing capabilities. | 10,000 | 2.2 | 1.4 | -55 to +200 |
| PTS-46303 | Filled silicone system with excellent thermal properties (1.4Wm°K). Fast flow for void free applications. This material does not require primers and has good adhesion to most substrates. It is commonly used for the encapsualtion of power supplies and other high voltage devices. This material passes Belcore85/85 and UL 94v0. (file E116296) | 8,000 | 2.2 | 1.4 | -55 to +200 |
| PTE-47850 | Filled epoxy system, excellent thermally conductive (1.3Wm°K) potting material for void free applications. This material bonds well to glass, ceramic, metal and plastic (FR4). 2 hour gel time | 20,000 | 2.0 | 1.3 | -55 to +150 |
| PTE-57851 | Filled epoxy system, excellent thermally conductive (1.3Wm°K) potting material for void free applications. This material bonds well to glass, ceramic, metal and plastic (FR4). 1 hour gel time. This product is available in various colors and viscosities. | 40,000 | 2.0 | 1.3 | -55 to +150 |
| PTE-36977 | Epoxy system for casting and encapsulation of high voltage coils where high temperature and high thermal conductivity are required. | 40,000 | 1.75 | 1.3 | |
| PNE-40824 | Filled Epoxy system designed to protect electronic devices from humidity and mechanical damage. This material provides near indestructible protective layer. Gel time of 20 minutes and can be cured at room temperature. | 13,000 | 1.15 | 1.2 | -55 to +200 |
| PNE-30270 | Filled epoxy system for semiconductor applications where protection is needed. This product is commonly used for glob top and various small device applications. It is a one-component system with > 5 days of pot life with a fast cure for inline use. This product is available in many viscosities. | 70,000 | 1.7 | 1.0 | -55 to +200 |
| PNE-30273 | Filled epoxy system for semiconductor applications where protection is needed. This product is commonly used for cavity fill, and various small device filling applications. It is a one-component system with 24 hour pot life with a fast cure for inline use. This product has a high TG (160) and low CTE (17) ideal for difficult product applications. | 6,000 | 1.8 | 1.1 | -55 to +210 |
| PNE-20262 | Filled epoxy system for semiconductor applications where protection is needed. This product is commonly used for cavity fill, and various small device filling applications. It is a one component system with 24 hour pot life with a fast cure for inline use. This product has a low CTE (10) ideal for difficult product applications where heat operation is not required.formerly L127-11 | 10,000 | 1.8 | 1.0 | -55 to + 150 |
| ATE-46446 | Filled epoxy system for high thermal applications such as heat-sink bonding. This material has 2.2 Wm⁰K thermal performance with supporting laser flash data. Room temperature cure. | 8,000 | 2.2 | 2.2 | -55 to +175 |
| IMPORTANT: The information contained in this data sheet corresponds to the present state of our knowledge; it is intended for your guidance but we are not bound by it since we are not in the position to exercise control over the manner in which our products are used. Moreover, the attention of the user is drawn to the risks that could occur should a product be used for an application other than for which it is intended. | |||||
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