Encapsulation and potting

Encapsulation, or potting, is the process of pouring resins – epoxies, silicones, urethanes, hybrids – into cavities containing electronic components to insulate and hold them in place while providing protection from shock and vibration. 

For example, sensitive components on PCBs require protection against external factors such as humidity, dust and chemicals.

LED assemblies, exposed to UV radiation or heat, require potting compounds as well.

PROTAVIC has developed a range of cyanate ester-based liquid resins which outperform the thermal resistance of current silicone and epoxy resins while ensuring very low CTE and strong adhesion to various substrates.

Some examples are listed in the following table.