Die-Attach
Due to the high volume of the smart card and RFID markets PROTAVIC has developed a range of Die-Attach chip adhesives that are compatible with the newer reverse “Flip-Chip” method and the traditional wire-bonding micro-connector method.
Some examples are listed in the table below.
Technical description
Name
Color
Chemistry
Density
Viscosity at 25°C (mPa.s)
Glass transition temperature (TG)
CTE (ppm/°C)
Shore hardness
Thermal conductivity (W/(m.K))
Open time
Polymerization / Crosslinking
Storage
PROTAVIC® ANE 10713
colorless
Epoxy
1,1
9000
110°C
95
D86
-
1 month
1 min at 150°C
6 months at 5°C
PROTAVIC® ANE 30100
Black
Epoxy
1,2
7000
110°C
55
-
-
1 week
60 min at 120°C
6 months at -20°C
PROTAVIC® ATE 10130
White
Epoxy
1.4
12000
75°C
55
-
0.7
5 days
90 min at 75°C
1 year at -20°C
PROTAVIC® ANE 10713
colorless
Epoxy
Chemistry1,1
Density9000
Viscosity at 25°C (mPa.s)110°C
Glass transition temperature (TG)95
CTE (ppm/°C)D86
Shore hardness-
Thermal conductivity (W/(m.K))1 month
Open time1 min at 150°C
Polymerization / Crosslinking6 months at 5°C
StoragePROTAVIC® ANE 30100
Black
Epoxy
Chemistry1,2
Density7000
Viscosity at 25°C (mPa.s)110°C
Glass transition temperature (TG)55
CTE (ppm/°C)-
Shore hardness-
Thermal conductivity (W/(m.K))1 week
Open time60 min at 120°C
Polymerization / Crosslinking6 months at -20°C
StoragePROTAVIC® ATE 10130
White
Epoxy
Chemistry1.4
Density12000
Viscosity at 25°C (mPa.s)75°C
Glass transition temperature (TG)55
CTE (ppm/°C)-
Shore hardness0.7
Thermal conductivity (W/(m.K))5 days
Open time90 min at 75°C
Polymerization / Crosslinking1 year at -20°C
Storage