Die-Attach

The Die-Attach process involves attaching a silicon chip to a lead frame or other substrate with an adhesive that is either electrically conductive or dielectric. PROTAVIC offers a range of adhesives specially designed for this purpose.

The choice of the chemistry depends on the final application and requirements:

  • epoxies,
  • acrylics,
  • polyimides
  • or hybrids.

PROTAVIC offers Die-Attach adhesives with high thermal conductivity, quick curing, very low CTE and low outgassing.

Some examples are listed in the table below.

Technical description

For more information, see the brochure:

Leaflet printed card