The Die-Attach process involves attaching a silicon chip to a lead frame or other substrate with an adhesive that is either electrically conductive or dielectric. PROTAVIC offers a range of adhesives specially designed for this purpose.
The choice of the chemistry depends on the final application and requirements:
- or hybrids.
PROTAVIC offers Die-Attach adhesives with high thermal conductivity, quick curing, very low CTE and low outgassing.
Some examples are listed in the table below.
For more information, see the brochure:
Leaflet printed card