To support the manufacturing of electronic components that serve a variety of specifications and uses, PROTAVIC has developed a range of resins and chemical adhesives meeting the needs of electronic component assembly: power modules, sensors, integrated circuits and MEMs.
To coat and protect components.
The Dam provides a protective barrier around the component, while the Fill fills in the area created by the Dam.
Glob-top provides the same two functions for smaller components.
Die-Attach is the bonding of semiconductors to substrates with an adhesive that is either electrically conductive or insulating.
Liquid insulating resins used to encapsulate printed circuits and electronic components, protecting them from environmental stressors.
Thermally conductive adhesives and resins that dissipate component operational heat generation.
Underfill is placed between a chip, or a BGA, and its support. The adhesive protects against possible shocks, drops and vibrations.
To coat and protect components.
The Dam provides a protective barrier around the component, while the Fill fills in the area created by the Dam.
Glob-top provides the same two functions for smaller components.