ATE-10120 Solvent Free Heat Cure Adhesive

DEFINITION

chemistryThe PROTAVIC® ATE 10120 is a solvent-free, single-component, electrically insulating, thermo-conducting adhesive for mounting components on a substrate when the bond does not need to be electrically conductive.  The product is easy to apply since no mixing is involved and its rheology makes it suitable for application by micro-dispenser or screen printing on automatic machines.

Adhesion on gold-plated silicon and on the metals and ceramics used in electronics is very good and comparable to that of the best silver-filled solvent free adhesives. The reactivity of the PROTAVIC® ATE 10120 is in the region of 1 min. at 150°C, which enables it to be
used for the insulating bonding of silicon crystals on heat-sensitive substrates.

APPLICATION PROPERTIES

The rheology of the PROTAVIC® ATE 10120 adhesive has been designed for application by microdispenser, pad or screen printing.  In all these applications, the long pot life and
absence of solvent ensure that the product remains at a reasonably constant viscosity and facilitates machine adjustments.

However, curing remains very quick just little as a few minutes at 140-150°C. After curing, the PROTAVIC® ATE 10120 adhesive sticks well on all types of substrate as well as
showing thermal stability up to around 350°C for a few seconds.  The product’s good thermal conductivity and high ionic purity prevent overheating and corrosion respectively, thereby contributing towards the reliability of the system.

METHOD OF SOLVENT FREE ADHESIVE USE

In order to obtain a non-porous adhesive joint, treatment under a vacuum of 1 mm of mercury for 15 min is desirable when the product is not supplied in a syringe which can be fitted directly onto the dispenser.  In the absence of stirring, provide a container which
is at least six times higher than the initial height of the mixture.

Surfaces to be stuck should be clean and free from dust or grease. Use a flame or solvent vapors if possible. Avoid chlorinated solvents which encourage corrosion.

Apply the adhesive with :

  • a micro-dispenser,
  • a metal screen printing screen with a mesh size
  • between 140 and 325
  • a pad
  • a spatula.

Cure according to one of the curing cycles which is compatible with the component, the substrate and the manufacturing conditions. In practice, cycles of 20 minutes at 100°C and 1-2 minutes at 140°C are widely used. The following post-curings are recommended :

  • 2-3 hours at 100°C
  • 1-2 hours at 125°C
  • 30 min.-1 hour at 150°C

TYPICAL PROPERTIES OF THE CURED SYSTEM

The properties mentioned below were obtained after curing for 1h at 150°C. They were determined following measurements carried out in the laboratory in a small number of tests.  They are values given by way of guidance, and do not constitute a guarantee.  It will be for the user, in all cases, to carry out his/her own tests to determine whether the PROTAVIC® ATE 10120 adhesive can be used for the particular application which he/she has in mind.

APPLICATIONS OF SOLVENT FREE ADHESIVE

The PROTAVIC® ATE 10120 insulating and thermoconductive adhesive has been specially developed for mounting high level integration logical circuits on lead frames.
Thermal conductivity reaches 1 W/(mK), which is only a little below the values obtained with adhesives with a 70 % silver content (2.5 to 3.5 W/(mK).  The shear strength is comparable with that of silver-filled resins and values of over 3 daN/mm2 at 90°C can be obtained on a circuit stuck onto its substrate.

The high ionic purity avoids problems of corrosion and ageing. It therefore contributes towards the reliability of systems which use the PROTAVIC® ATE 10120.