Single Component Resin – PNE-30273 (Formerly L 127-3)


A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals.  Its good fluidity enables it to flow at 20°C into cavities about 1 mm in width.  The glass transition temperature is over 150°C, which helps to improve the thermal shock resistance, for example in the case of alternators diodes
for cars.


The consistency of PROTAVIC® PNE 30273 coating resin has been designed for application by micro-dispenser.  The rheology allows good wetting of surfaces in contact with the resin and also good adhesion. It is possible to fill cavities less than 1 millimeter in size.

Adjusting the automatic dispensers is made easier by the fact that the viscosity of the product remains stable for one day at 18-22°C.  One must take care however not to leave the product, after dispense, in contact with moist air for longer than 1 to 2 h. Although not strongly hygroscopic, the PROTAVIC® PNE 30273 resin shows a slight drop in glass transition in the presence of moisture. It is therefore preferable to cure as quickly as possible after applying the product or storing in a dry atmosphere.  We recommend removing the PROTAVIC® PNE 30273 resin from the freezer 30 to 60 minutes before
it is due to be used in order for it to reach a temperature of between 18 and 22°C.


The PROTAVIC® PNE 30273 resin is supplied frozen and ready for use. It can be supplied in syringes designed to fit on the micro-dispenser, which has the advantage of avoiding handling operations which encourage the entrainment of air bubbles.  When the product is supplied in pots, the resin should preferably be degassed for 15 minutes under a vacuum of less than 1 mm of mercury. In the absence of stirring, during the vacuum treatment, provide a container which is at least six times higher than the initial height of resin.

Optimum application is provided by means of a pneumatic dispenser and needles with an  internal diameter of between 0.5 and 1.5 mm.  The product can be cured at temperatures from 125°C for a period of at least 30 minutes, but post-curing for 1-2 h at 150-205°C is recommended in order to achieve optimum protection of a silicon crystal.  In order to minimize shrinkage, it is recommended that the product should be cured at a constant
temperature of 110°C for 1-2 h before raising it to the final curing temperature.


The properties set out below were obtained after curing for 1 h at 110°C + 4 h at 160°C.
They were determined following measurements carried out in the laboratory over a small number of tests.  They are values given by way of guidance, and do not constitute a guarantee. It will be for the user, in all cases, to carry out his/her own tests to determine
whether the PROTAVIC® PNE 30273 resin can be used for the particular application which he/she has in mind.


The PROTAVIC® PNE 30273 single-component, high purity insulating resin has been developed for protecting semi-conductors in the field of alternators diodes, MCM, chip carriers, hybrid circuits, chip on board applications and diodes. Its coefficient of linear expansion of 18.10-6/°C and its glass transition temperature of over 160°C gives
it good resistance to thermal shocks.  The high ionic purity guarantees good reliability of
the semi-conductor. The same is true if the adhesion on different substrates which offers optimum protection against external agents (moisture, dust, etc.)


Refer to the enclosed safety data sheet.


The PROTAVIC® PNE 30273 resin is supplied in 1000 g cartridges.