ELECTRICALLY CONDUCTIVE OVEN CURE DIE ATTACH ADHESIVE
PVIC® ACE34560 electrically conductive die attach adhesive is designed for high reliability semiconductor packaging application. This high-purity material exhibits less void and low resin bleed out with significant bond strength in the high temperature and humidity condition. Its good rheology also allows minimum adhesive dispense and die placement times along with no tailing & stringing phenomenon during dispense. In addition, its long work life is being considered as the advantage of this product.
- Single component
- Excellent dispensability
- Long work life
- Minimal resin bleed and low condensable volatiles
- Oven cure
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Photo coupler and Diodes
|Cure Condition||At 190°C for 30min
At 175°C for 1hr (alternate cure condition in box oven)
|Work life @ 22°C||1 week|
|Estimated Storage life at -40°C||1 year|
|TEST ITEMS||STANDARD||TEST METHOD|
|Viscosity @ 25°C||11700cps @ 5.0 rpm||BHS-K-108|
|Volume Resistivity||0.000352 ohm-cm||BHS-K-110|
|Die Shear Strength (Si to Cu L/F)
@ RT (80×80mil2)
@ 250°C (186×70mil2)
|Weight loss on cure||7.12 Wt.%||BHS-K-111|
|Weight loss in TGA
|Glass Transition Temp. (Tg)||130 °C||BHS-K-116|
|Thermal Conductivity||2.8 W / mk||Laser flash|
|≤ 15 ppm
≤ 10 ppm
≤ 5 ppm
Place the container to stand vertically for 30min -1 hour. DO NOT open the container before adhesive reaches ambient temperature to prevent the moisture condensation. Any moisture that collects on the thawed container should be removed prior to use. Adhesives that appear to have separated should not be used.
Adhesive should be stored @ -40°C or colder. The shelf life of the material is only valid when the material has been stored at the correct storage condition.
PVIC adhesives are packaged in syringes or pots per customer specification. For the details, please contact our Customer Service or sales department.