ACE-34034 Thermal and Electrical Conductivity Adhesive

ELECTRICALLY CONDUCTIVE, HIGH THERMAL CONDUCTIVE
DIE ATTACH ADHESIVE

Description

PVIC® ACE34034 electrically conductive and thermally conductive die attach adhesive is specially designed for packages which need high thermal conductivity such as RF ICs and LEDs. It also has a good workability in auto dispensing or stamping process.

Application Package

Devices which need high thermal conductivity (Power Devices, RF ICs, and LEDs)

Features

  • Single component
  • High thermal conductivity
  • Very low drying during process

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Product Information

Filler type Silver
Resin Epoxy
Cure Condition Ramp to 175℃ for 30 min + hold 175°C for 30 min
Work life @ 25°C 24 hrs
Estimated Storage life at -40°C 1 year

 

filler-5x619Instruction

 Thawing

Place the container to stand vertically for 30min – 1 hour. DO NOT open the container before adhesive reaches ambient temperature to prevent the moisture condensation. Any moisture that collects on the thawed container should be removed prior to use. Adhesives that appear to have separated should not be used.

Storage

Adhesive should be stored @ -40℃ or colder. The shelf life of the material is only valid when the material has been stored at the correct storage condition.

Availability

PVIC adhesives are packaged in syringes or pots per customer specification. For the details, please contact our Customer Service or sales department.

 Properties

TEST ITEMS STANDARD TEST METHOD
Specific Gravity 4.30 BHS-K-112
Viscosity @ 25°C 11,000cps @ 5.0 rpm BHS-K-108
Thixotropic Index 6.0 BHS-K-108
Volume Resistivity 0.0001 ohm-cm BHS-K-110
Die Shear Strength (Si to Cu L/F)
@ RT (58×50mil2)
@ 250°C (250×250mil2)
.
> 7.0 kg
> 3.0 kg
.
BHS-K-109
.
Hot-Wet Die Shear Strength
after 85%/85°C/24hr
@250°C(80×80mil2)
 1.8 kg BHS-K-109
 DSC Onset 162 °C
Peak 163 °C
BHS-K-113
 Glass Transition Temp. (Tg) TMA  99.5 °C BHS-K-116
Ionic impurity
– Chloride
– Sodium
– Potassium
 .
≤ 15 ppm
≤ 10 ppm
≤ 10 ppm
BHS-K-104
Thermal Conductivity > 20 W / m.k
TMA by Expansion
@α1
@α2
 .
35 ppm
120 ppm
BHS-K-117
Modulus
@ 25℃
@ 100℃
@ 250℃
.
60 MPa
42 MPa
68 MPa
BHS-K-118