ELECTRICALLY CONDUCTIVE, HIGH THERMAL CONDUCTIVE
DIE ATTACH ADHESIVE
Description
PVIC® ACE34034 electrically conductive and thermally conductive die attach adhesive is specially designed for packages which need high thermal conductivity such as RF ICs and LEDs. It also has a good workability in auto dispensing or stamping process.
Application Package
Devices which need high thermal conductivity (Power Devices, RF ICs, and LEDs)
Features
- Single component
- High thermal conductivity
- Very low drying during process
————————————————————————————————————————————
Get a Quick Price: Click Here for a volume-pricing request
————————————————————————————————————————————
Product Information
| Filler type | Silver |
| Resin | Epoxy |
| Cure Condition | Ramp to 175℃ for 30 min + hold 175°C for 30 min |
| Work life @ 25°C | 24 hrs |
| Estimated Storage life at -40°C | 1 year |
Instruction
Thawing
Place the container to stand vertically for 30min – 1 hour. DO NOT open the container before adhesive reaches ambient temperature to prevent the moisture condensation. Any moisture that collects on the thawed container should be removed prior to use. Adhesives that appear to have separated should not be used.
Storage
Adhesive should be stored @ -40℃ or colder. The shelf life of the material is only valid when the material has been stored at the correct storage condition.
Availability
PVIC adhesives are packaged in syringes or pots per customer specification. For the details, please contact our Customer Service or sales department.
Properties
| TEST ITEMS | STANDARD | TEST METHOD |
| Specific Gravity | 4.30 | BHS-K-112 |
| Viscosity @ 25°C | 11,000cps @ 5.0 rpm | BHS-K-108 |
| Thixotropic Index | 6.0 | BHS-K-108 |
| Volume Resistivity | 0.0001 ohm-cm | BHS-K-110 |
| Die Shear Strength (Si to Cu L/F) @ RT (58×50mil2) @ 250°C (250×250mil2) |
. > 7.0 kg > 3.0 kg |
. BHS-K-109 . |
| Hot-Wet Die Shear Strength after 85%/85°C/24hr @250°C(80×80mil2) |
1.8 kg | BHS-K-109 |
| DSC | Onset 162 °C Peak 163 °C |
BHS-K-113 |
| Glass Transition Temp. (Tg) TMA | 99.5 °C | BHS-K-116 |
| Ionic impurity – Chloride – Sodium – Potassium |
. ≤ 15 ppm ≤ 10 ppm ≤ 10 ppm |
BHS-K-104 |
| Thermal Conductivity | > 20 W / m.k | – |
| TMA by Expansion @α1 @α2 |
. 35 ppm 120 ppm |
BHS-K-117 |
| Modulus @ 25℃ @ 100℃ @ 250℃ |
. 60 MPa 42 MPa 68 MPa |
BHS-K-118 |