ELECTRICAL PLUS HIGH THERMAL CONDUCTIVE
ADHESIVE FOR DIE ATTACH ON LEDs & RF ICs, ETC
PVIC® ACE34034-X2 electrically conductive, thermally conductive die attach adhesive is specially designed for packages which need high thermal conductivity such as RF ICs and LEDs. It also has a good workability in auto dispensing or stamping process. This product has an improved adhesion on Au plated substrate than ACE34034.
Devices which need high thermal conductivity (Power Devices, RF ICs, and LEDs)
- Single component
- High thermal conductivity
- Very low drying during process
Get a Quick Price: Click Here for a volume-pricing request
|Cure Condition||Ramp to 175℃ for 30 min + hold 175°C for 30 min|
|Work life @ 25°C||24 hrs|
|Estimated Storage life at -40°C||1 year|
Place the container to stand vertically for 30min â€“ 1 hour. DO NOT open the container before adhesive reaches ambient temperature to prevent the moisture condensation. Any moisture that collects on the thawed container should be removed prior to use. Adhesives that appear to have separated should not be used.
Adhesive should be stored @ -40°C or colder. The shelf life of the material is only valid when the material has been stored at the correct storage condition.
PVIC adhesives are packaged in syringes or pots per customer specification. For the details, please contact our Customer Service or sales department.
|TEST ITEMS||STANDARD||TEST METHOD|
|Viscosity @ 25°C||11,000cps @ 5.0 rpm||BHS-K-108|
|Volume Resistivity||0.0001 ohm-cm||BHS-K-110|
|Die Shear Strength (Si to Cu L/F)
@ RT (58×50mil2)
@ 250°C (250×250mil2)
> 7.0 kg
> 3.0 kg
|Hot-Wet Die Shear Strength
|Die Shear Strength (Si to Au Sub.)
@ RT (50×50mil2) @ 250°C (160×160mil2)
|DSC||Onset 147 °C
Peak 163 °C
|Glass Transition Temp. (Tg) TMA||99.5 °C||BHS-K-116|
≤ 15 ppm
≤ 10 ppm
≤ 10 ppm
|Thermal Conductivity||> 20 W / m.k||–|
|TMA by Expansion