ACE-34034-X2 Electro & High Thermal Conductivity Epoxy

ELECTRICAL PLUS HIGH THERMAL CONDUCTIVE
ADHESIVE FOR DIE ATTACH ON LEDs &  RF ICs, ETC

Description

PVIC® ACE34034-X2 electrically conductive, thermally conductive die attach adhesive is specially designed for packages which need high thermal conductivity such as RF ICs and LEDs. It also has a good workability in auto dispensing or stamping process. This product has an improved adhesion on Au plated substrate than ACE34034.

Application Package

Devices which need high thermal conductivity (Power Devices, RF ICs, and LEDs)

Features

  • Single component
  • High thermal conductivity
  • Very low drying during process

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Product Information

Filler type Silver
Resin Epoxy
Cure Condition Ramp to 175℃ for 30 min + hold 175°C for 30 min
Work life @ 25°C 24 hrs
Estimated Storage life at -40°C 1 year

 

filler-5x619Instruction

Thawing

Place the container to stand vertically for 30min – 1 hour. DO NOT open the container before adhesive reaches ambient temperature to prevent the moisture condensation. Any moisture that collects on the thawed container should be removed prior to use. Adhesives that appear to have separated should not be used.

Storage

Adhesive should be stored @ -40°C or colder. The shelf life of the material is only valid when the material has been stored at the correct storage condition.

Availability

PVIC adhesives are packaged in syringes or pots per customer specification. For the details, please contact our Customer Service or sales department.

Properties

TEST ITEMS STANDARD TEST METHOD
Specific Gravity 4.30 BHS-K-112
Viscosity @ 25°C 11,000cps @ 5.0 rpm BHS-K-108
Thixotropic Index 6.0 BHS-K-108
Volume Resistivity 0.0001 ohm-cm BHS-K-110
Die Shear Strength (Si to Cu L/F)
@ RT (58×50mil2)
@ 250°C (250×250mil2)
.
> 7.0 kg
> 3.0 kg
.
BHS-K-109
.
Hot-Wet Die Shear Strength
after 85%/85°C/24hr
@250°C(80×80mil2)
1.8 kg BHS-K-109
Die Shear Strength (Si to Au Sub.)
@ RT (50×50mil2) @ 250°C (160×160mil2)
2.2 kg
2.6 kg
BHS-K-109
DSC Onset 147 °C
Peak 163 °C
BHS-K-113
Glass Transition Temp. (Tg) TMA 99.5 °C BHS-K-116
Ionic impurity
– Chloride
– Sodium
– Potassium
.
≤ 15 ppm
≤ 10 ppm
≤ 10 ppm
BHS-K-104
Thermal Conductivity > 20 W / m.k
TMA by Expansion
@α1
@α2
.
35 ppm
120 ppm
BHS-K-117
Modulus
@ 25℃
@ 100℃
@ 250℃
.
60 MPa
42 MPa
68 MPa
BHS-K-118