UL RECOGNIZED ENCAPSULANT/ADHESIVE
The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides long term circuit protection from -55ºC. to 125ºC.. The material bonds well to most metals, ceramics and plastics as well as to epoxy and paper phenolic circuit boards and, when necessary, allows repair by cutting away material in the area of the affected component, replacing the component and re-potting.
- LOW SHRINKAGE DURING CURE
- EXCELLENT FLEXIBILITY AT LOW AND HIGH TEMPERATURE
- EXCELLENT FLOW BEFORE AND DURING CURE
- WATER WHITE COLOR AND SMOOTH SURFACE AFTER CURE
- EXCELLENT HEAT RESISTANCE
- ROOM TEMPERATURE REPAIRABILITY
- EXCELLENT ADHESION TO MOST SUBSTRATES WITHOUT PRIMERS
- FLAME RETARDANT
- EXCELLENT HUMIDITY RESISTANCE
PNU 46201 contains no MDI or TDI and all active isocyanate is polymeric in nature. Neither Part A nor Part B should be exposed to ambient air for prolonged periods of time, and the containers should be covered when not in use. If the components are to be used in a continuous mixer, the feed tanks should be vented through a desiccated air vent or dry Nitrogen. Components to be encapsulated should be clean and dry, and should not be contaminated with solder flux, silicone grease or other uncured materials.
For evaluation or small production runs, warm 100 g of Part A to 35ºC. (95ºF) and mix thoroughly with 15.4 g of Part B in a metal or plastic container (no more than 1/3 full) with a metal or plastic spatula. Degas for 10 to 15 minutes at 0.5mmHg or less. This step gets rid of air that was incorporated during mixing and can be eliminated in actual production if meter mix machines are used. Cure per instructions above.