Single Component Resin – PNE-20262 (Formerly L 127-11)


Single component resin with very low linear expansion of 10 ppm per degree and high ionic purity for protecting semi-conductor silicon crystals, in particularly BGA.


The consistency of PROTAVIC® PNE 20262 coating resin has been designed for application by micro-dispenser.  The rheology allows good wetting of surfaces in
contact with the resin and also good adhesion. It is possible to fill cavities less than 1 millimeter in size.  Adjusting the automatic dispensers is made easier by the fact that the viscosity of the product remains stable for 5-6 days at 15-25°C.  One must take care however not to leave the product, after dispense, in contact with moist air for longer than 1 to 2 hrs.

Although not strongly hygroscopic, PROTAVIC® PNE 20262 resin shows a slight
drop in glass transition in the presence of moisture.  It is therefore preferable to cure as quickly as possible after applying the product.  We recommend removing PROTAVIC® PNE 20262 resin from the freezer 15 to 30 min. before it is due to be used in order for it to reach a temperature of between 18 and 22°C.


The properties set out below were obtained after curing for 1 h at 175°C.  They were  determined following measurements carried out in the laboratory over a small number of
tests.  They are values given by way of guidance, and do not constitute a guarantee. It will be for the user, in all cases, to carry out his/her own tests to determine whether PROTAVIC® PNE 20262 resin can be used for the particular application which he/she has in mind.


PROTAVIC® PNE 20262 resin is supplied frozen and ready for use. It can be supplied in syringes designed to fit on the microdispenser, which has the advantage of avoiding handling operations which encourage the entrainment of air bubbles.  When the product is supplied in pots, the resin should preferably be degassed for 15 min. under a vacuum of less than 1 mm of mercury. In the absence of stirring, during the vacuum treatment,
provide a container which is at least six times higher than the initial height of resin.
Optimum application is provided by means of a pneumatic dispenser and needles with an internal diameter of between 0.5 and 1.5 mm.  The product can be cured at temperatures from 125°C for a period of at least 15 min., but post-curing for 1-2 h at 150-175°C is recommended in order to achieve optimum protection of a silicon crystal.


PROTAVIC® PNE 20262 single-component, high purity insulating resin has been developed for protecting semi-conductors in the field of MCM, chip carriers, hybrid circuits and chip on board applications, and BGA.  It is generally recommended for large-sized semiconductors due to its coefficient of linear expansion of 10 ppm/°C.  The high ionic purity guarantees good reliability of the semi-conductor. The same is true of the adhesion on different substrates which offers optimum protection against external agents (moisture, dust, etc.)


Refer to the attached safety data sheet.


The PROTAVIC® PNE 20262 resin is supplied in 500 g cartridges.