CONDUCTIVE EPOXY ADHESIVE
METADUCT 1201 is a 100% solids, solvent free, highly conductive adhesive. It is a true plastic solder which can be cured at room temperature or in a few minutes at elevated temperatures – but much lower than any soldering temperatures. Not only does it form tenacious conductive adhesive bonds, but also makes room temperature soldering possible.
METADUCT 1201 is a true conductor. Its specific resistivity is less than 0.1 ohm-cm. It is supplied in a paste form so that it will not flow when applied. It adheres tenaciously to glass, aluminum, steel, tin, lead, copper, ceramic, most plastics and to many other surfaces.
DIRECTIONS FOR USE:
1.Weigh out desired amount of METADUCT 1201 BASE.
2.Weigh out 3 parts METADUCT 1201 ACTIVATOR for each 100 parts METADUCT 1201 BASE. Mix thoroughly. This is important.
3.Apply to the surface. A spatula or wooden tongue depressor is convenient. Thickness of glue line is not critical.
Overnight at room temperature (bond will improve over next 2 days), or any one of the following alternate schedules:
For very high bond shear strength, certain surface preparations are often advisable. Consult our Technical Sales Laboratory.
A. Catalyzed Paste
|Pot Life, Minutes||90 to 120|
B. Cured Conductive Adhesive
|Volume Resistivity, ohm-cm||less than 0.1|
|Operating Temperature, °F||-70° to 350|
|Shear Strength, psi, @ 75°|
|Flexural Strength, psi||11400|
METASTRIP 701 is a very effective non-corrosive stripping solvent for removal of cured epoxy resin compounds, so that valuable electronic components can be salvaged.
Technical information and recommendations made by Protavic America, Inc. concerning products and uses or applications thereof, are based on reliable laboratory tests and are believed to be accurate. No warranty, however, is expressed or implied, nor is any warranty expressed or implied as to results to be obtained from use of said materials, whether used singly or in combination with other products. No statements made are to be construed as constituting a license under any existing patent.