ONE PART EPOXIES

ChipEpoxy Encapsulants, Dam & Fill and Glob Top Formulations for Semiconductor Applications

Click on a product name for more information and to download its TDS. You can also mouse over some of the data in this table for more details.

Product Name & TDS Description
Viscosity SG
CTE
Hardness Operating
tg °C
PNE-30252 Black Filled epoxy
DAM for PNE series
105,000 1.8
40
90D -55°C to +210°C
140°C
PNE-30270 Black Filled epoxy
GLOB TOP w/ Low CTE
70,000 1.7
18
90D -55°C to +200°C
150°C
PNE-30273 Black Filled epoxy
CAVITY FILL w/ Low CTE/High Tg
6,000 1.8
17
90D -55°C to +210°C
160°C
PNE-20262 Black Filled epoxy
CAVITY FILL w/ lowest CTE
10,000 1.8
10
95D -55°C to +150°C
110°C
ATE-26522 Black Filled epoxy
Fast cure for small applications
40,000 1.88
55
92D -55°C to +180°C
140°C
PNE-26052 Clear Filled epoxy
Ideal one part for power devices
225 150 85D -55°C to +150°C