One Component Heat Curable Adhesives

Industrial Strength Adhesives

Click on a one component product name for more information and to download its TDS.

Product Name Description Viscosity Cure*fastest Strength
PSI
Operating °C
Tg
ATE-10120 Gray or White Filled Epoxy
Thermally Conductive
25,000 3min* 3,000 -55°to +155°
80°C
ANE-26144 Amber Unfilled epoxy
Ferrite & Optical Bonding
3,700 1min* 3,200 -55°to +180°
137°C
ANE-17794 Amber Unfilled Epoxy
Ferrite & Optical Bonding
6,000 1min* 2,600 -55°to +175°
100°C
ANE-16120 Amber Unfilled Epoxy
Ferrite Bonding
3,000 3min* 3,000 -55°to +155°
80°C
ATE-26522 Black Filled epoxy
Low CTE Bonding
40,000 1 min* 2,800 -55°to +180°
137°C
ANE-20961 Black Underfill Epoxy
Board Level Underfill / Flexible
6,000 6 min* 3,000 -50°to +150°
40°C
BNE-20220 Filled Epoxy
B-Stage Printable
30,000 1-10 sec* 100n -50°C to +200°C
63°C
BNE-20210 Filled Epoxy
B-Stage Printable
27,000 1-10 sec* 100n -50°C to +150°C
65°C
ANA-10199R White Epoxy
Re-Workable Underfill.
5,000 10 min* 1,450 -30°C to +150
0°C
PNE-37850 Water Clear Epoxy
Encapsulation &Adhesive
1,000 30 min* 4,500 -50°C to +150°C
80°C
ANE-10701 White Insulating Epoxy
Fast Cure Chip Attach
65,000 5-10 sec* 3,500 -55°C to +180°C
120°C
ANE-10932 Cream Epoxy
Insulating Chip Attach
25,000 1 min* 4,500 -50°C to +150°C
150°C
ANE-10931 Grey Insulating Epoxy
Board Level Underfill
25,000 60 sec* 2,000 -55°C to +190°C
150°C
ANE-20904 Black Insulating Epoxy
Board Level Fast Flow Underfill
25,000 50 sec* 2,000 -55°C to +120°C
40°C
ANE-10700 Yellow Insulation Epoxy
No-Flow Board Level Underfill
8,000 10 sec* 2,000 -55°C to +190°C
150°C
ANA-10710 Black Insulating Epoxy
Smart Card / RFID Die Attach
8,000 10 sec* 2,000 -55°C to +190°C
150°C
Metreset 321 Black-Brown-gray
High Viscosity
60,000 40 min* ≤3,200 -55°C to +204°C
111°C
350-FC Amber
High Temperature
≤20,000 120 min* 11,000 -55°C to +350°C
255°C