DEFINITION
The electrically conductive PROTAVIC® ACH 20120 adhesive is designed for BGA
IC packages and LED dies PROTAVIC® ACH 20120 presents excellent properties of
flexibility, good adhesion and moisture resistance, no voids which allow package 10
withstand 260°C Pb-free re-flow temperature. More over PROTAVIC® ACH 20120
reaches high electrical conductivity and good thermal conductivity for heat removing
Its specific reactivity combines both Latency al room temperature and fast curing
cycle.
APPLICATION PROPERTIES
PROTAVIC® ACH 20120 adhesive features excellent hot/wet adhesive properties.
Its good latency enables it to be kept at 20±2°C for 1 day with a little increase of
viscosity, so the viscosity remains virtually unchanged throughout the working day..
The long pot life and the absence of solvent ensure that the product remains at a
reasonably constant viscosity and facilitate application.
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PROTAVIC® ACH 20120 may be oven cured at moderate temperature (175°C) and also snap cured when heated at 22O-230°C.
PRODUCT DESCRIPTION
| Appearance | Viscous liquid | |
| Odor | Slight | |
| Color | Sliver | |
| Guaranteed specifications | Standards | Method |
| Cone and plate viscosity (5 rpm – 25°C) | 9 000 ± 1500 mPa.s | NFT 51211 |
| Other information | ||
| Pot life* at 20 ± 2°C | > days | |
| Volume resistivity | 0.03 mΩ.cm | |
| Density | 4.5 approx. | |
| Thixotropy index | 4.0 | |
| Possible curing cycles | 30 minutes at 175°C 2 minutes at 230°C |
|
| Storage stability | 1 year at T<-20°C | |
* Defined as 100% viscosity increase
METHOD OF USE
- Take the package out of the freezer not more than 1 hour before use in order to prevent any re-absorption of moisture.
- Work on clean surfaces or clean all surfaces in order to remove any dirt or grease. Do not deposit the adhesive on a substrate which has just been cleaned with chlorinated solvents.
- Apply the adhesive (by dispensing)
- Cure using one of the curing cycles compatible with the components, the substrate and the manufacturing conditions.
FIELDS OF USE
The excellent properties of PROTAVIC® ACH 20120 adhesive make it especially suitable for use in structural sticking where softness, void-free bond-line, moisture resistance and thermal resistance are required.
PHYSICO-CHEMICAL PROPERTIES
| Properties | Methods | Results | |
| Weight loss by TGA | At 200 °C At 300°C |
TGA 1 | 0.4% 0.8% |
| Tg by TMA | TMA 1 | 10°C | |
| Coefficient of thermal expansion α1 α2 |
. 98 ppm/°C 126 ppm/°C |
||
| SHORE D hardness | NFT 51109 | 85D | |
| Volume resistivity | ECA 1 | 0.03 mΩ.cm | |
| Moisture absorption (168 hours @ 85°C/85% Hr) | R 0802 | 0.15% | |
| Young’s modulus | Dynamic mechanical thermal analysis |
1.64 GPa at 25°C 200 MPa at 100°C 75 Mpa at 250°C |
|
| Die shear strength at 25°C oven cure (30 minutes at 175°C) |
7.2 kg/die | 2×2 mm² (80x80mil²) Si die on Ag plated Cu frame |
|
| Die shear strength at 250°C | 6.1 kg/die . 7.5 kg/die . |
3.5×3.5 mm² (140x140mil²) Si die on Ag plated Cu frame 6.35×6.35 mm² (250x250mil²) Si die on Ag plated Cu frame |
|
| Die shear strength at 250°C after 85°C moisture saturation exposure for 1 day. |
5.5 kg/die 7.0 kg/die |
3.5×3.5 mm² (140x140mil²) Si die, Ag plated Cu frame 6.35×6.35 mm² (250x250mil²) Si on Ag plated Cu frame |
|
PRECAUTION IN USE
Refer to the attached material safety data sheet.
PACKAGING
PROTAVIC® ACH 20120 adhesive is supplied in 40 g and 125 g syringes.