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STRUCTURAL ADHESIVES
Our adhesives are engineered for demanding applications. We use unique raw materials to create products that offer high performance and value. Because we manufacture a wide variety of our own raw materials, we can formulate from the ground up. This helps keep you on the cutting edge of technology with custom engineered hybrid resins which offer low modulus and high moisture resistance. Please review the partial listing below for some of our best sellers.
Benefits
· High Shear Strength
· Low moisture absorption
· low modulus materials
 Denotes MixPac™& TAH™compatible
|
| Product |
Description |
Mix Ratio |
Mixed Viscosity |
Lap Shear / PSI
Die/Kg. |
Operating Temp. °C |
| ANE-26144 |
Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. |
10:1
|
3,700 |
3,200 |
-55 to +180 |
| ANE-17794 |
Clear unfilled epoxy in a one-part system that can be stored at room temperature for up to 6 months. This material is excellent for ferrite and ceramic bonding applications. Non-hazardous and safe to use. Requires heat assist to cure. |
One Part |
6,000 |
2,600 |
-55 to +175 |
| ANE-47927 |
Filled epoxy system. Excellent chemical and heat resistance. Excellent for stencil and screen bonding due to its high strength fast cure at low temperatures. |
2:1
|
60,000 |
3,000 |
-60 to +140 |
| ANE-57103 |
Fast cure (10 minute) epoxy system. Excellent stacking and fixturing. This material is toughened for outstanding thermal shock resistance. |
1:1
|
10,000 |
4,500 |
-50 to +130 |
| ANE-47932 |
Filled epoxy system. Very high performance material designed for difficult bonding applications. This material will bond to stencil foil without holes and can withstand high heat and harsh chemical environments. Requires heat assist. |
1:1
|
40,000 |
3,200 |
-60 to +180 |
| ANE-46505 |
Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time. Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassing requirements. |
1:1
|
30,000 |
3,800 |
-55 to 140 |
| ANE-46515 |
Amber epoxy system for high strength applications. Bonds well to metals, plastics and wood. Can be use as a general- purpose adhesive. 20-minute gel time. Available in colors and higher or lower viscosities. Passes NASA outgassing requirements. |
1:1
|
40,000 |
4,500 |
-55 to +140 |
| ATE-46446 |
Filled epoxy system for high thermal applications such as heat-sink bonding. This material has 2.2 Wm⁰K thermal performance with supporting laser flash data. Room temperature cure. |
100:9 |
8,000 |
4,200 |
-55 to +175 |
| ATE-10120 |
Filled one-part system with 30 days of storage at room temperature. Electronics grade, offers excellent bond strength while dissipating heat up to 1Wm⁰K. Often used as a die & lid attach material. Requires low heat assist for cure. Ideal for applications requiring low-heat curing. |
One Part |
25,000 |
3,000 |
-55 to +155 |
| PNU-56200 |
Amber urethane system. Offers a fast (5-minute) cure and bonds well to metal, leather, vinyl and wood. Electronics grade, often used for wire stacking. This material is flexible yet tough enough to handle vibration applications. |
1:1
|
5,000 |
2,000 |
-55 to +120 |
| PNU-46202 |
Water Clear urethane system. This material does not yellow and can be used for bonding plastic, glass, and many other types of substrates. It is excellent for applications requiring flexibility. Gel time is 10 minutes. |
1:1
|
5,000 |
2,000 |
-55 to +120 |
| ANE-10931 |
Epoxy system commonly used as an underfill material. This material is designed to survive extreme heat and can be used on various sized BGA devices. It can be used for STB underfill protection applications. |
One Part |
25,000 |
3,000 |
-55 to +200 |
| ANE-20904 |
Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. |
One Part |
25,000 |
2,000 |
-55 to + 120 |
| ANE-10700 |
Epoxy system designed as a no- flow underfill material that can be used for any application where
high reliability and fast cure is required. This material is commonly used for bonding microchips on RFID antennas and other die-attach applications. This material offers an 8-hour pot life and requires less than 10 seconds to cure. |
One Part |
8,000 |
2,000 |
-55 to +200 |
| PNE-40824 |
Adhesive & Encapsulant. Filled Epoxy system designed to protect electronic devices from humidity and mechanical damage. This material provides near indestructible protective layer. Gel time of 20 minutes and can be cured at room temperature. |
2:1
|
20,000 |
7,000 |
-55 to +300 |
| ANA-10199R |
Re-workable Underfill. This product offers 100% cross linking at 80-100c and can be removed between 280-300c. |
One Part |
5,000 |
1,450 |
-30 to +150 |
| ANE-10932 |
Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing. |
One Part |
25,000 |
4,500 |
-50 to +150 |
| ANH-20110 |
Non-Conductive Hybrid Adhesive with high reliability. Low modulus and low stress for die bonding of array and laminate based BGA packages. This product can withstand 260c with excellent moisture resistance. |
One Part |
10,000 |
5.6kg |
-50 to +260 |
| ANH-20111 |
Die attach adhesive is designed for BGA packages. Protavic ANH-20111 presents excellent properties of flexibility, good adhesion and moisture resistance which allow package to withstand 260°C Pb-free reflow temperature. Its specific reactivity combines both latency at room temperature and fast curing cycle. |
One Part |
11,000 |
5.6kg |
-55 to +260 |
| ANE-10701 |
Electrically insulating one component adhesive for die attach uniquely designed for RFID chips. This product offers a 7 day pot life with medium reactive temperature. It offers high speed dispense and cure characteristics. |
One Part |
65,000 |
3,500 |
-55 to +180 |
| ANE-54807M2 |
Two component room temperature adhesive for Ingot Bonding. This product is designed as an adhesive for beam to ingot in semiconductor or solar cell wafer slicing of 2-8 inch diameter ingots. This product offers fast cure time, high strength, easy removal in hot water and easy 1:1 mix ratio. |
1:1
|
25,000 |
300kg/cm2
|
-40 to +150 |
| ANE-44038 |
Two component room temperature adhesive for Beam to Work plate Bonding. This product is designed as an adhesive for beam to work plate in semiconductor or solar cell wafer slicing. This product offers fast cure time, high strength, and easy 1:1 mix ratio. |
1:1
|
20,000 |
200kg/cm2 |
-40 to +180 |
| ANE-44037LP |
Two component room temperature adhesive for Ingot Bonding. This product is designed as an adhesive for beam to ingot in semiconductor wafer slicing of 8-12 inch diameter ingots. This product offers fast cure time, high strength, easy removal in hot water and easy 1:1 mix ratio. |
1:1
|
24,000 |
200kg/cm2
|
-40 to +180 |
| ANE-50030R |
Removable epoxy two component adhesive designed for silicon processing application. It has been formulated for use in processes in which adhesives must be resistant to hot water and/or hot PEG and has to be removed in acidic conditions. |
1:1
|
30,000 |
200kg/cm2 |
-40 to +150 |
| ANE-20961 |
Fast flow, fast cure capillary underfill. The rheology of Protavic ANE-20961 in combination with its low glass transition temperature and its very low coefficient of thermal expansion makes the product perfect for high reliability underfill application where some softness is required. |
One Part |
6,000 |
3,000
|
-50 to +150 |
| BNE-20220 |
Die attach, electrically insulating, crystalline silica loaded, B-stageable epoxy adhesive. This product is designed for screen printing applications (wafer backside coating). It has very good latency of paste at room temperature, very good latency of B-stage products and fast final curing. |
One Part |
30,000 |
145 |
200 |
| BNE-20210 |
Die attach adhesive, electrically insulating, carbon loaded, B-stageable epoxy adhesive. This product is designed for printing applications (wafer backside coating). It has very good latency of paste at room temperature, very good latency of B-stage products and fast final curing. |
One Part |
27,000 |
145
| 200 |
| IMPORTANT: The information contained in this data sheet corresponds to the present state of our knowledge; it is intended for your guidance but we are not bound by it since we are not in the position to exercise control over the manner in which our products are used. Moreover, the attention of the user is drawn to the risks that could occur should a product be used for an application other than for which it is intended.
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